Very Small Pixel Pitch Focal Plane Array And Method For Manufacturng Thereof

ABSTRACT

A method for manufacturing an imaging device is provided. The method comprises forming a contact pad over a semiconductor substrate. The contact pad has a malleable metal. The method further comprises providing a readout circuit having a first side and a contact plug. The contact plug has a base affixed to the first side of the readout circuit and a plurality of prongs extending from the base away from the first side. The first side of the readout circuit is moved towards the substrate so that the prongs of the contact plug are pressed into the pad and displace a portion of the pad into a space defined by and between a first and a second of the prongs. Stop elements formed over the substrate are aligned with and contact stop elements provided on the readout circuit so that the prongs are inhibited from passing completely through the contact pad.

FIELD OF THE INVENTION

The present invention relates to imaging devices. More particularly, the present invention relates to an imaging device having a focal plane array with a readout circuit and method of manufacturing thereof, where each pixel of the focal plane array has a very small pitch with dimensions corresponding to the cutoff wavelength of the photodetector of the respective pixel.

BACKGROUND OF THE INVENTION

The image resolution that can be achieved from conventional infrared focal plane arrays (IR FPA), even with the most favorable optics, are generally limited by the pixel pitch. In the most advanced conventional FPAs, the smallest pixel pitch dimensions are 12 microns for mid wavelength (MW) IR with a nominal cutoff wavelength of 5 microns. In the long wavelength (LW) IR bands with cutoff wavelengths of around 10 microns, the smallest pixel pitch observed by the applicant for conventional FPAs is 15 microns.

To enhance and further optimize image resolution, the pixel pitch of an FPA for an imaging device or photodetector needs to be comparable to the wavelength of radiation being detected. Among the primary limitations in reducing the pixel pitch of conventional imaging devices or photodetectors are the architecture of the FPA and associated readout circuit contacts and the fabrication technique for electrical interconnection of the FPA to the unit cells of the associated readout circuit. These limitations are especially compelling for the shorter wavelength IR bands with cutoff wavelengths of 2.5 microns or less.

Using high density vertically integrated photodiode (HDVIP®, a trademark of DRS Technologies, Inc.) architecture, a pixel pitch as small as 6 microns and via diameters as small as 2 microns are practically feasible. With these dimensions, fill factors of approximately 90% may be realized. FIG. 1 shows the variation in fill factor versus pixel pitch for an FPA implementing pixels with HDVIP® architecture and having one of three different values of via diameters. As shown in FIG. 1, for smaller pixel pitches (e.g., less than 6 microns), the fill factor drops rapidly even for a via diameter of 2 microns and, thus, compromises the overall photodetector performance.

There is therefore a need for an FPA with associated readout circuit contact architectures and fabrication techniques that enables the realization of imaging devices with pixel pitches approaching the wavelength of radiation to be detected without compromising the fill factor of each photodetector. This is especially a stressing requirement for the short wavelength or SWIR spectral band with cutoff wavelengths ≦2.5 microns. In addition to image resolution, smaller pixel pitch IR FPAs enable reduced size of optics, reduced cooling requirements, which in turn leads to a smaller package, lower power consumption and reduced overall weight.

SUMMARY OF THE INVENTION

In accordance with systems and articles of manufacture consistent with the present invention, an imaging device having an improved focal plane architecture is provided. The imaging device comprises a semiconductor layer (such as an semiconductor infrared absorbing layer) and a photodetector having an implanted region formed in the semiconductor layer to define a p-n (or n-p) junction therein, and a pad formed or deposited over the implanted region. The pad has a malleable metal or metallic material, such as Indium. The imaging device further comprises a readout circuit having a contact plug. The contact plug has a base and a prong extending from the base and into the malleable metallic material of the pad. In one implementation, the prong is a first of a plurality of prongs extending from the base and into the malleable metallic material of the pad. The prongs have a structure effective to displace a portion of the malleable metallic material into a space between the first prong and a second of the prongs.

In addition, in accordance with methods consistent with the present invention, a method is provided for manufacturing an imaging device. The method comprises forming a contact pad having a malleable metallic material over a surface of a semiconductor substrate (e.g., such the pad is formed over the surface of a photodetector formed in the semiconductor substrate), and providing a readout circuit having a first side and a contact plug. The contact plug has a base affixed to the first side of the readout circuit and a plurality of prongs extending from the base away from the first side. The method further comprises moving the first side of the readout circuit towards the substrate surface so that the prongs of the contact plug are pressed into the pad and displace a portion of the pad into a space defined by and between a first and a second of the prongs.

In one implementation, the method further comprises: forming a first pair of stop elements over the semiconductor substrate surface so that the contact pad is disposed between the first pair of stop elements; and providing a second pair of stop elements on the first side of the readout circuit so that the base of each contact plug is disposed between the second pair of stop elements and in substantial alignment with the first pair of stop elements formed over the substrate surface. In this implementation, the first side of the readout circuit is moved towards the substrate surface in substantial axial alignment with the first and second pairs of stop elements until the first pair of stop elements contacts the second pair of stop elements. A first of the first pair of stop elements and a first of the second pair of stop elements have a combined thickness that is more than a length of each prong such that the prongs are inhibited from passing completely through the contact pad when the first pair of stop elements contacts the second pair of stop elements.

In accordance with systems and articles of manufacture consistent with the present invention, another imaging device having an improved focal plane architecture and effective to provide two color detection is provided. The imaging device comprises a first semiconductor layer having a first surface and a second surface; and a first photodetector having a first implanted region formed in the first semiconductor layer and a pad formed over the first implanted region. The pad has a malleable metallic material. The imaging device also comprises a readout circuit disposed over the first surface of the first semiconductor layer. The readout circuit has a plurality of contact plugs facing the first surface of the first semiconductor layer. A first of the contact plugs has a first base and a first prong extending from the first base and into the malleable metallic material of the pad of the first photodetector. The imaging device further comprises a second semiconductor layer disposed below the second surface of the first semiconductor and a second photodetector having a second implanted region formed in the second semiconductor layer. In addition, the imaging device has a metalized via extending through the first semiconductor layer through an insulated via and the second semiconductor layer so that the metalized via electrically only connects the second implanted region of the second photodetector to a second of the contact plugs of the readout circuit, enabling the imaging device to detect two wavelength bands or two portions of a band (e.g., two colors of the visible band or infrared band).

Other systems, methods, features, and advantages of the present invention will be or will become apparent to one with skill in the art upon examination of the following figures and detailed description. It is intended that all such additional systems, methods, features, and advantages be included within this description, be within the scope of the invention, and be protected by the accompanying claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an implementation of the present invention and, together with the description, serve to explain the advantages and principles of the invention. In the drawings:

FIG. 1 is a graph depicting the variation in the fill factor percentage of a conventional HDVIP® photodetector of a pixel as a function of the pixel's pitch for three different “via” diameters for various pixel pitch on a focal plane array (FPA);

FIGS. 2A-2B show a flow chart depicting a process for manufacturing an imaging device in which a photodetector array and a ROIC are aligned and interconnected in accordance with the present invention;

FIGS. 3A to 3F and 3H to 3J are cross sectional views of an exemplary photodetector array and an exemplary ROIC of an imaging device manufactured in accordance with the process depicted in FIG. 2, where the photodetector array and the ROIC are illustrated at various steps of the manufacturing process;

FIG. 3G is a top level view of the exemplary photodetector array corresponding to the cross-sectional view in FIG. 3F and before the ROIC having one or more contact plugs is applied in accordance with the present invention to the photodetector array as depicted in FIGS. 3H-3J; and

FIG. 4 is a cross sectional view of another imaging device manufactured in accordance with the present invention, in which the imaging device has an exemplary ROIC, a first exemplary photodetector array manufactured in accordance with the process depicted in FIG. 2, and a second exemplary photodetector array that collectively form a two color focal plane array for the imaging device.

DETAILED DESCRIPTION OF THE INVENTION

Reference will now be made in detail to an implementation in accordance with methods, systems, and products consistent with the present invention as illustrated in the accompanying drawings.

Methods consistent with the present invention provide a process 200 depicted in FIGS. 2A-2B for manufacturing a focal plane array (FPA) of an imaging device, where an array of photodetectors with dimensions comparable to the cutoff wavelength of the respective photodetector is aligned with and interconnected to a unit cell of a readout integrated circuit (ROIC or readout circuit) to enable the realization of very small pixel pitches. FIGS. 3A to 3F and 3H to 3J are cross sectional views of an exemplary photodetector array 302 and an exemplary ROIC 304 of an imaging device 300 (as completed in FIG. 3J), where the photodetector array 302 and the ROIC 304 are illustrated at various steps of the manufacturing process 200. FIG. 3G is a top level view of the exemplary photodetector array 302 corresponding to the cross-sectional view in FIG. 3F and before the ROIC 304 having one or more contact plugs 350 a-350 c is applied in accordance with the present invention to the photodetector array 302 as depicted in FIGS. 3H-3J. Each contact plug 350 a-350 c is associated with and reflects a respective unit cell of the ROIC 304.

As shown in FIG. 2A and FIG. 3A, a passivation layer 310 is initially formed over a semiconductor substrate or layer 312 having a first conductivity type (step 202). In a pre-processing step, the semiconductor layer 312 may initially be formed over or deposited on a substrate (not shown in figures) comprising cadmium zinc telluride (e.g., when the semiconductor layer 312 comprises mercury-cadmium telluride), indium phosphide (e.g., when the semiconductor layer 312 comprises indium gallium arsenide), or other material suitable for forming a semiconductor layer. The substrate upon which the semiconductor layer 312 is formed may be removed using any known semiconductor device manufacturing technique, which is not described to avoid obscuring the present invention.

The passivation layer 310 may comprise cadmium telluride (CdTe), cadmium zinc telluride, cadmium telluride selenium, zinc sulfide, or any other suitable passivation material. The passivation layer 310 has a thickness in a range of 30 nm to 250 nm.

In one implementation, the semiconductor substrate or layer 312 comprises an infrared sensitive material, such as mercury cadmium telluride (HgCdTe), mercury zinc telluride (HgZnTe), mercury cadmium zinc telluride (HgCdZnTe), cadmium telluride (CdTe), cadmium zinc telluride (CdZnTe), indium gallium arsenide (InGaAs), or indium antimonide (InSb), doped with a material, such as Arsenic (As) or Copper (Cu), to form a p-type semiconductor layer. Alternatively, the semiconductor layer 312 may comprise silicon, germanium, gallium arsenide (GaAs), indium antimonide (InSb), other III V or II VI compound semiconductors, or the like, suitable for forming a photodetector. In an alternative implementation, the semiconductor substrate or layer 312 may be doped with another material so that the semiconductor layer 312 has a second conductivity type (e.g., n-type) different from the first conductivity type (e.g., p-type). For example, the semiconductor substrate or layer 312 may be doped with Boron (B) or other n-type material layer. Accordingly, each photodetector (as reflected by implanted regions 314 a-314 c in FIG. 3B) fabricated in the photodetector array 302 in accordance with the present invention may have a p-on-n or a n-on-p architecture and corresponding junction without departing from the scope of the present invention.

In addition, as shown in FIGS. 3A-3F and 3H-3J, the starting detector material may have another passivation layer 316 formed on a back-side 318 of the semiconductor layer 312 to form a double sided passivated semiconductor layer 302, allowing for front-side illumination of the photodetector array 302. In an alternative implementation, the manufacturing steps discussed here may be applied so that the photodetectors of the array 302 are formed on the back-side 318 of the semiconductor layer 302 with the passivation layer 310 remaining intact over the front-side of the semiconductor layer 302, allowing for back-side illumination of the photodetector array 302.

Continuing with FIG. 2A, the passivation layer 310 is patterned using photolithography and etched using a dry or a wet etching technique, to form openings such as 320 a, 320 b and 320 c in the passivation layer 310 (step 204) that expose the substrate 312. One of ordinary skill in the art would appreciate that other patterning and etching techniques may be employed without departing from the present invention. The openings 320 a, 320 b and 320 c may each have a width (w) within the range of 0.3 μm to 1 μm (and preferably less than 0.8 μm), allowing each photodetector (as represented by the implanted regions 314 a-314 c) to be formed to a pixel pitch that is approximately equal to a cutoff wavelength of the radiation to be detected by the respective photodetector.

Next, one or more implanted regions 314 a, 314 b and 314 c are formed in the substrate, via the one or more openings, where each implanted region has a second conductivity type that is different than the first conductivity type of the substrate 312 (step 206). For example, when the semiconductor layer 312 is comprised of HgCdTe doped with Arsenic (As) to have a p-type conductivity, Boron (B+) may be implanted, via each opening 320 a, 320 b and 320 c, into the substrate 312 to form implanted regions 314 a, 314 b or 314 c having an n-type conductivity. Each implanted region 314 a, 314 b or 314 c having the second conductivity type forms a junction with the substrate 312 having the first conductivity type to effectively form a n-on-p architecture associated with a respective photodetector. Alternatively, each photodetector may be implemented to have a p-on-n junction architecture when the semiconductor layer 312 is doped with Indium, for example, to have n-type conductivity. Note, in an alternative implementation, following the patterning, the implants may be formed through the passivation layer before the formation of the contact openings 320 a, 320 b and 320 c via etching.

Each implanted region 314 a, 314 b and 314 c has the approximate width (w) of the opening 320 a, 320 b or 320 c through which the respective implanted region was formed. Thus, the photodetector represented by the respective implanted region 314 a, 314 b or 314 c is formed to a pixel pitch that is approximately equal to a cutoff wavelength of the radiation to be detected by the respective photodetector. For example, the pixel pitch (e.g., d₁, as shown in FIG. 3H) of the photodetector represented by implanted region 314 a may be approximately 2.5 microns or less, corresponding to the cutoff wavelength of the SWIR spectral band.

After forming the implanted regions 314 a, 314 b and 314 c, a base contact 322 a, 322 b or 322 c is formed over each implanted region 314 a, 314 b and 314 c in each contact opening 320 a, 320 b and 320 c (step 208). Each base contact 322 a, 322 b or 322 c is comprised of a metal or metal alloy and is formed to a thickness substantially equal to the thickness of the initial passivation layer 310. In one implementation, each base contact 322 a, 322 b and 322 c has two layers 324 a and 326 a, 324 b and 326 b or 324 c and 324 c. The first layer 324 a, 324 b or 324 c is comprised of a first type of material that substantially bonds or adheres to the material comprising the implanted region 314 a, 314 b or 314 c (e.g., Boron doped HgCdTe). The second layer 326 a, 326 b or 326 c is comprised of a second type of material that substantially bonds or adheres to the first layer material and to the malleable metallic material comprising each pad (e.g., each pad 332 a, 332 b or 332 c in FIG. 3F comprises Indium). In one implementation, the first layer 324 a, 324 b or 324 c of each base contact comprises Nickel (Ni) deposited over a respective implanted region 314 a, 314 b or 314 c to have a thickness of approximately 100 Angstroms or within a range of 50 Angstroms to 150 Angstroms. In this implementation, the second layer 326 a, 326 b or 326 c of each base contact comprises Titanium (Ti) deposited over a respective first layer 324 a, 324 b or 324 c to have a thickness of approximately 100 Angstroms or within a range of 50 Angstroms to 1000 Angstroms. The thickness of the Titanium is equal to or greater than the thickness of the Nickel in the base contact. In one implementation, the thickness of the Nickel is sufficient to enable the Titanium portion of the base contact to adhere to a respective pad 332 a, 332 b or 332 c comprised of Indium. In this implementation, the second layer 326 a, 326 b or 326 c of Titanium adheres better than Nickel to the Indium used to form the contact pad.

As shown in FIG. 2A and FIG. 3D, a self-limiting photo-resist layer 328 is then deposited or formed over each base contact 322 a, 322 b or 322 c and remaining initial passivation layer 310 to have a first thickness within a range of 0.5 μm to 1 μm (step 210). As shown in FIG. 3E, a pad opening 330 a, 330 b or 330 c is formed (e.g., via patterning and etching) in the photo-resist layer 328 over each base contact 322 a, 322 b and 322 c (step 212). Each opening 330 a, 330 b and 330 c may extend from the top of the photo-resist layer 328 to the base contact 322 a, 322 b and 322 c, which may be exposed via the etching process.

Next, a pad 332 a, 332 b or 332 c comprised of a malleable metallic material or alloy, such as Indium or suitable Indium alloy, is formed in each pad opening 330 a, 330 b and 330 c (step 214) as shown in FIG. 3F. In one implementation, each pad 332 a, 332 b and 332 c is formed to have the first thickness of the photo-resist layer 328.

As depicted in FIG. 3F, the photo-resist layer 328 is then patterned and etched to form at least a first pair of stop elements (e.g., 334 a and 334 d) on the initial passivation layer 310 so that each pad 332 a, 332 b and 332 c is disposed between the first pair of stop elements (e.g., 334 a and 334 d) and each of the first pair of stop elements has a second thickness that is different than the first thickness of the pad (step 216). As discussed in further detail below, at least the first pair of stop elements (e.g., 334 a and 334 d) on the photodetector array 302 are adapted to contact at least a second pair of stop elements (e.g., 362 a and 362 d in FIG. 3H) on the readout circuit 304 so as to inhibit further movement of the readout circuit 304 towards the photodetector array 302, preventing damage to the base contacts 322 a, 322 b and 322 c and underlying photodetector implanted regions 314 a, 314 b and 314 c. In the implementation shown in FIGS. 3F and 3G, the first pair of stop elements may be two of a plurality of stop elements 334 a-334 l formed from the photo-resist layer 328 on the initial passivation layer 310 of the photodetector array 302 in accordance with the present invention. In one implementation, each pad 332 a, 332 b, 332 c, 332 d, 332 e and 332 f may be disposed between a respective pair of stop elements. For example, as shown in FIG. 3G, a pad 332 a may be disposed between a pair of stop elements 334 a and 334 b located near opposing sides 336 and 338 of the pad 332 a or between a pair of stop elements 334 a and 334 f located near opposing corners 334 a and 334 f so as to contact a corresponding pair of stop elements on the readout circuit 304 so as to inhibit further movement of the readout circuit 304 towards the respective pad 332 a of the photodetector array 302, preventing damage to the base contact 322 a and photodetector implanted region 314 a underlying the pad 332 a. To provide further reliability in connecting the ROIC 304 to the photodetector array 302 as further described herein, each pad 332 a-332 f may be disposed between a respective four stop elements located about the pad 332-333 f. For example, as shown in FIG. 3G, each pad (e.g., pad 332 a) may be disposed between a respective four stop elements (e.g., 334 a, 334 b, 334 e and 334 f) located near corners (e.g., 340, 342, 344 and 346) of the respective pad.

In addition, although the pads 332 a-332 f are shown in FIG. 3G as having a square shape, each pad 332 a-332 f may have a polygon, circular or other shape without departing from the spirit of the present invention. Furthermore, although the stop elements 334 a-334 l are depicted as square posts, the stop elements 334 a-334 l may also have a polygon, circular or other shape and be formed in a strip or line without departing from the spirit of the present invention. Moreover, in an alternative implementation, each pad 332 a-332 f may be surrounded on at least three sides by a single stop element (e.g., 334 a) formed in a strip or line.

Turning to FIG. 2B, a readout circuit 304 is formed or provided that has a first side 348 and a contact plug 350 a, 350 b or 350 c for each pad 332 a, 332 b and 332 c (step 218). Each contact plug 350 a, 350 b or 350 c has a base 352 a, 352 b and 352 c affixed to the first side 348 of the readout circuit 304 and one or a plurality of prongs 354 a-354 c, 356 a-356 c or 358 a-358 c, extending from the base 352 a, 352 b or 352 c away from the first side 348 of the ROIC 304. Each contact plug 350 a, 350 b or 350 c may comprise a material (such as Tungsten) that may be pressed into and substantially bond or adhere to the malleable metallic material or metal alloy (e.g., Indium or alloy thereof) comprising a respective pad 332 a-332 f, either with or without an annealing processing step. Each prong of a respective contact plug 350 a, 350 b or 350 c may have a polygon, circular or other shape. Each prong 354 a-354 c, 356 a-356 c or 358 a-358 c may extend a length (L) from the top side 348 of the ROIC 304 that is within a range of 0.25 microns to 0.5 microns. In addition, each prong 354 a-354 c, 356 a-356 c or 358 a-358 c may have a diameter or width (w) is within a range of 0.25 microns to 0.5 microns. Each set of adjacent prongs (e.g., 354 a and 354 b) define a space 360 therebetween. In one implementation, the combined width of the prongs and spaces 360 between adjacent prongs for a contact plug (e.g., 350 a) does not exceed the width (d) of the pad (e.g., 332 a) to which the contact plug is to be connected as described below or the pixel pitch (d₁) of the photodetector associated with the pad (e.g., 332 a).

As shown in FIG. 2B, a second pair of stop elements (e.g., stop elements 362 a and 362 d in FIG. 3H) are provided or formed on the first side 348 of the readout circuit 304 so that the base 352 a, 352 b or 352 c of each contact plug 350 a, 350 b and 350 c is disposed between the second pair of stop elements (e.g., stop elements 262 a and 262 d) and in substantial axial alignment with the first pair of stop elements (e.g., 334 a and 334 d) of the photodetector array 302 (step 220). Each of the stop elements of each contact plug 350 a, 350 b and 350 c has a third thickness such that the combined thickness of a stop element (e.g., 362 a) of a contact plug (e.g., 350 a) and a corresponding stop element (e.g., 334 a) of the photodetector array 302 is more than the length (L) of each prong (e.g., 354 a-354 c) of the respective contact plug (e.g., 350 a) such that the prongs (e.g., 354 a-354 c) are inhibited from passing completely through the associated pad (e.g., 332 a).

In the implementation shown in FIG. 3H, the second pair of stop elements of the readout circuit 304 may be two of a plurality of stop elements 362 a-362 d provided or formed on the first side 348 of the readout circuit 304. In one implementation, each contact plug 350 a, 350 b and 350 c may be disposed between a respective pair of stop elements 362 a-362 d. For example, as shown in FIG. 3H, a contact plug 350 a may be disposed between a pair of stop elements 362 a and 362 b located near opposing sides (as reflected by prongs 354 a and 354 c) of the contact plug 350 a, or between a pair of stop elements located near opposing ends or corners (not shown in figures) of the contact plug 350 a. In the implementation of the photodetector array 302 shown in FIG. 3G, the readout circuit 304 may have a stop element 362 a-362 l (elements 362 e-362 l not shown in the figures) for each stop element 334 a-334 l of the photodetector array 302. In this implementation, each of the stop elements 362 a-362 l of the readout circuit 304 are substantially aligned with and adapted to contact a corresponding stop element (e.g., element 334 a-334 l) of the photodetector array 302 so as to inhibit further movement of the readout circuit 304 towards the pads 332 a-332 f of the photodetector array 302, preventing damage to the base contact and photodetector implanted region underlying each pad 332 a-332 f.

Continuing with FIG. 2B, the first side 348 of the readout circuit 304 is moved towards the semiconductor substrate or layer 312 of the photodetector array 302 in substantial axial alignment with the stop elements 334 a-334 d of the photodetector array and the stop elements 362 a-362 d of the readout circuit 304 such that the prongs 354 a-354 c, 356 a-356 c or 358 a-358 c of each contact plug 350 a, 350 b and 350 c are pressed into each pad 332 a, 332 b and 332 c and displace a portion (e.g., 364 a, 364 b, 364 c, 364 d, 364 e or 364 f) of the respective pad into the space 360 between adjacent prongs (step 222).

The first side 348 of the readout circuit 304 continues to be moved towards the photodetector array 302 in substantial axial alignment with the stop elements 334 a-334 d of the photodetector array and the stop elements 362 a-362 d of the readout circuit 304 until each stop element of the photodetector array 302 (or the first pair of stop elements 334 a and 334 d) contacts a corresponding stop element of the readout circuit 304 (or the second pair of stop elements 362 a and 362 d) as shown in FIG. 3I. As previously noted, the combined thickness of each stop element of the photodetector array 302 (e.g., each of the first pair of stop elements 344 a and 334 d) and the corresponding stop element of the readout circuit 304 (e.g., corresponding one of the second pair of stop elements 362 a and 362 d) is more than the length (L) of each prong 354 a-354 c, 356 a-356 c and 358 a-358 c such that the prongs are inhibited from passing completely through the respective pad 332 a, 332 b or 332 c (step 224).

In an alternative implementation, step 220 is skipped and stop elements 362 a, 362 b, 362 c and 362 d are not formed that the first side 348 of the readout circuit 304. In this implementation, in step 222, the first side 348 of the readout circuit 304 is moved towards the semiconductor substrate or layer 312 of the photodetector array 302 such that the prongs 354 a-354 c, 356 a-356 c or 358 a-358 c of each contact plug 350 a, 350 b and 350 c are pressed into a respective one of the pads 332 a, 332 b and 332 c and displace a portion (e.g., 364 a, 364 b, 364 c, 364 d, 364 e or 364 f) of the respective pad into the space 360 between adjacent prongs. In addition, in this implementation in step 224, the first side 348 of the readout circuit 304 continues to be moved towards the photodetector array 302 until each stop element of the photodetector array 302 (or the first pair of stop elements 334 a and 334 d) contacts the first side 348 of the readout circuit 304. In this implementation, the thickness of each stop element of the photodetector array 302 (e.g., each of the first pair of stop elements 344 a and 334 d) is more than the length (L) of each prong 354 a-354 c, 356 a-356 c and 358 a-358 c such that the prongs are inhibited from passing completely through the respective pad 332 a, 332 b or 332 c.

In one implementation, to facilitate the hybridization of each contact plug 350 a-350 c of the readout circuit 304 to a corresponding pad 344 a-344 c of the photodetector array 302, the photodetector array 302 may be warmed to a predetermined temperature that is below the melting point of the material used to form each pad 332 a-332 c. For example, when each pad 332 a-332 c is comprised of Indium, the photodetector array 302 may be warmed to a predetermined temperature that is equal to or less than 80° C.

Before or while the photodetector array 302 is being warmed, epoxy 366 (shown in FIG. 3J) may be injected or wicked into a cavity 368 a-368 f (shown in FIG. 3I), a portion of which is defined by two or more of the following: a pad 332 a, 332 b or 332 c; a stop element 334 a-334 n of the photodetector array 302 (e.g., a first 334 a of the first pair of stop elements 334 a and 334 d); a corresponding stop element 362 a-362 n of the readout circuit 304 (e.g., a first 362 a of the second pair of stop elements 362 a and 362 d) in contact with the stop element (e.g., 334 a) of the photodetector array 302; the initial passivation layer 310 and the first side 348 of the readout circuit 304 (step 226). Note the predetermined temperature may be above the melting point of the material used to form the photo-resist layer 328 from which the stop elements 344 a-344 d of the photodetector array 302 are formed. In this implementation, the stop elements 344 a-334 d and/or the epoxy 366 flows to surround and encapsulate the perimeter of each pad 332 a, 332 b or 332 c, preventing excess malleable metallic material (e.g., Indium) of one pad (e.g., pad 332 a) from shorting to an adjacent pad (e.g., 332 b or 332 d in FIG. 3G). Once the photodetector array 302 is cooled back to room temperature, the wicking process is ended as the epoxy 366 and/or stop elements 344 a-334 d made from photo-resist material solidify. The combination of the photodetector array 302 and the respective unit cells of the ROIC 304 form the FPA of the imaging device 300, and may be mounted on a chip carrier.

Turning to FIG. 4, another imaging device 400 manufactured consistent with the present invention is shown. The imaging device 400 incorporates the ROIC 304 (i.e., ROIC 404 in FIG. 4) and the photodetector array 302 (i.e., photodetector array 402 in FIG. 4) of the imaging device 300. The photodetector array 402 and ROIC 404 are each manufactured and connected to each other in accordance with the process depicted in FIG. 2 as previously discussed, except as noted below. As shown in FIG. 4, the imaging device 400 also includes a second photodetector array 406 formed below the first photodetector 402. As further described herein, the ROIC 404, the first photodetector array 402 and the second photodetector array 406 collectively form a two color focal plane array of the imaging device 400, in which each unit cell (as shown in FIG. 4) of the focal plane array has a smaller pitch (e.g., D equal to or less than 15 μm) than other conventional two color imaging devices.

Consistent with the photodetector array 302 and the manufacturing process depicted in FIG. 2, the photodetector array 402 of the imaging device 400 includes a first semiconductor layer 312 having a first surface 317 (which may be a front-side surface) and a second surface 318 (which may be a back-side surface) upon which a respective passivation layer 310 or 316 is formed. The first semiconductor layer 312 has a first conductivity type (e.g., p-type) and include an infrared sensitive material, such as HgCdTe, HgZnTe, HgCdZnTe, CdTe, CdZnTe, InGaAs or InSb. A first implanted region 314 a is formed in the first semiconductor layer 312 to form a p-on-n or a n-on-p architecture for a first photodetector of the first photodetector array 402.

A base contact 322 a is formed over the implanted region 314 a. The base contact 322 a is comprised of a metal or metal alloy and is formed to a thickness substantially equal to the thickness of the initial passivation layer 310. As previously described, the base contact 322 a may have two layers 324 a and 326 a. In this implementation, the first layer 324 a is comprised of a first type of material (e.g., Nickel) that substantially bonds or adheres to the material comprising the implanted region 314 a (e.g., Boron doped HgCdTe). The second layer 326 a is comprised of a second type of material (e.g., Titanium) that substantially bonds or adheres to the first layer material and to the malleable metallic material comprising the pad 332 a, which is formed on the base contact 332 a for the first photodetector (as reflected by the implant 314 a) of the photodetector array 402. In one implementation, the malleable metallic material comprising the pad 332 a is Indium or a suitable Indium alloy.

The ROIC 404 is disposed over the first surface 317 of the first semiconductor layer 312 and the passivation layer 310 formed thereon. The ROIC 404 has a plurality of contact plugs (e.g., 350 a and 450 a in FIG. 4) facing the first surface 317 of the first semiconductor layer 312. A first 350 a of the contact plugs 350 a and 450 a has a first base 352 a and one or more prongs 354 a-354 c extending from the first base 350 a and into the malleable metallic material of the pad 332 a of the first photodetector. A second 450 a of the contact plugs is disposed adjacent to the first contact plug 350 a. The second contact plug 450 a includes a second base 452 a and may include one or more prongs 454 a and 454 b extending from the second base 452 a.

The second photodetector array 406 includes a second semiconductor layer 412 disposed below the second surface 318 of the first semiconductor layer 312. A respective passivation layer 410 and 416 may be formed on a front-side surface 417 and back-side surface 418 of the second semiconductor layer 412 in the same manner as described for the first semiconductor layer 312.

A second implanted region 414 is formed in the second semiconductor layer 412 adjacent to and below (but not directly beneath) the first implant region 314 a of the first semiconductor layer 312. The second semiconductor layer 412 has a conductivity type (e.g., p-type) that is different from the conductivity type (e.g., n-type) of the second implanted region 414 to form the p-on-n or n-on-p architecture for the second photodetector in the second semiconductor layer 412.

In one implementation as shown in FIG. 4, two or more layers 419 a-419 b of filler material and/or epoxy may be disposed between and used to attach the lower passivation layer 316 formed on the second surface 318 of the first semiconductor layer 312 and the upper passivation layer 410 formed on the front-side 417 or upper surface of the second semiconductor layer 412.

As shown in FIG. 4, the imaging device 400 includes a metalized via 420 extending through the first photodetector array 402 (and the first semiconductor layer 312 thereof) and through the second photodetector array 406 (and the second semiconductor layer 412 thereof) so that the metalized via 420 electrically connects the second implanted region 414 formed in the second semiconductor layer 412 to the second base 452 a or prong 454 a or 454 b of the second contact plug 450 a of the ROIC 404. Thus, each unit cell of the ROIC 404 has two contact plugs 350 a and 450 b, each of which is connected to a respective photodetector (as reflected by implants 314 a and 414) formed in one of the two semiconductor layers 312 and 412, enabling the imaging device 400 to detect two different wavelengths or colors in a predetermined band.

The metalized via 420 may be formed using known via boring techniques. In one implementation, the second implant region 414 in the second semiconductor layer 412 (as well as a third implant region 422 in the first semiconductor layer 312) is formed during the via boring process. In one process for forming the metalized via 420, the first photodetector array 402 and the ROIC 404 are first formed and connected together in accordance with the manufacturing process depicted in FIG. 2. A first bore hole (having side walls 426 defined by the third implant region 422 in FIG. 4) is then formed through the first semiconductor layer 312 (and the passivation layers 310 and 316 sandwiching the first semiconductor layer 312) in perpendicular alignment with the second contact plug 450 a of the ROIC 404. An insulation film 424 is then deposited on the side walls 426 of the first bore hole using known deposition techniques to prevent contact between the metalized via 420 and the first semiconductor layer 312 or the third implant region 422 therein. In one implementation, the insulation film 424 may be deposited so that the insulation film 424 extends through the first semiconductor layer 312 to the base 452 a of the second contact plug 450 a. If necessary, the first bore hole may be re-bored at a smaller diameter in order to remove excess insulation or insulation blocking access to the base 452 a of the second contact plug 450 a. A first portion 428 of the metalized via 420 may then be deposited over the insulation film 424 in the first bore hole so that the metalized via 420 is electrically connected to the second contact plug 450 a but not the first semiconductor layer 312 or the third implant region 422 that may be formed therein during the boring process. A filler material 430, such as epoxy, may be deposited over the first portion 428 of the metalized via 420 to fill any excess area in the first bore hole. A second portion 432 of the metalized via 420 may be deposited as a layer on top of the filler material 430 to provide a base contact extension in proximity to the second or back-side surface 318 of the first semiconductor layer 312.

Next, a second bore hole (having side walls 434 defined by the second implant region 414) is formed through the second semiconductor layer 412 (and the passivation layers 410 and 416 sandwiching the second semiconductor layer 412) in perpendicular alignment with base contact extension (e.g., the second portion 432 of the metalized via 420) and the second contact plug 450 a of the ROIC 404. A third portion 436 of the metalized via 420 may then be deposited on the side walls 434 of the second bore hole so that the metalized via 420 electrically connects the second implant region 414 to the base contact extension 432 and, thus, to the second contact plug 450 a. Thus, the ROIC 404 is structured to read the first photodetector defined by the first implant region 314 a in the first semiconductor layer 312 and to read the second photodetector defined by the second implant region 414 in the second semiconductor layer 412, where the second implant region 414 is disposed adjacent to and below (but not directly beneath) the first implant region 314 a of the first photodetector in the first semiconductor layer 312. In this implementation, the first photodetector as defined by the first implant region 314 a is effective to detect a first wavelength associated with a first portion of a predetermined band (e.g., the visible band or infrared band) that passes through the second semiconductor layer and into the first semiconductor layer 312. The second photodetector defined by the second implant region in the second semiconductor layer is effective to detect a second wavelength associated with a second portion of the predetermined band. Wavelengths 460 associated with the first portion of the predetermined band and detected by the first photodetector in the first semiconductor layer 312 are longer than wavelengths 470 associated with the second portion of the predetermined band and detected by the second photodetector in the second semiconductor layer 412.

In accordance with the present invention, the imaging device 400 further comprises a first pair of stop elements (e.g., 334 a and 334 b) each of which is disposed over the first surface 317 of the first semiconductor layer 312 such that the pad 332 a of the first photodetector is disposed between the first pair of stop elements 334 a and 334 b. The ROIC 404 has a second pair of stop elements (e.g., 362 a and 362 b) disposed on the first side 348 of the ROIC 404. The base 352 a of the first contact plug 350 a is affixed to the first side 348 of the ROIC 404 such that the prong 354 a of the first contact plug 350 a extends away from the first side 348 of the ROIC 404 and between the second pair of stop elements 362 a and 362 b. When the ROIC 404 is moved towards the first surface 317 of the first semiconductor layer 312, the first pair of stop elements 334 a and 334 b formed over the semiconductor layer 312 (and formed on the passivation layer 310 in one implementation) contact the second pair of stop elements 362 a and 362 b of the ROIC 404 such that each prong 354 a-354 c of the first contact plug 322 a is inhibited from passing completely through the pad 332 a of the first photodetector.

As shown in FIG. 4, the imaging device 400 further comprises a third pair of stop elements 480 a and 480 b each of which is disposed over the first surface 317 of the first semiconductor layer 312 such that the metalized via 420 is disposed between the third pair of stop elements 480 a and 480 b. The ROIC 404 has a fourth pair of stop elements 490 a and 490 b disposed on the first side 484 of the ROIC 404. The third pair of stop elements 480 a and 480 b is disposed relative to and contacting the fourth pair of stop elements 490 a and 490 b such that each prong 454 a and 454 b of the second contact plug 450 a is inhibited from contacting the first surface 318 of the first semiconductor layer 312.

As previously discussed, when the first side 348 of the ROIC 404 is moved towards the first semiconductor layer 312 of the first photodetector array 402 in substantial axial alignment with the stop elements 334 a-334 b and 480 a-480 b of the first photodetector array and the stop elements 362 a-362 b and 490 a-490 b of the ROIC 404, the prongs 354 a-354 c of the first contact plug 350 a is pressed into the pad 332 a and displaces a portion of the pad 332 a into the space between adjacent prongs (e.g., 354 a and 354 b or 354 b and 354 c).

While various embodiments of the present invention have been described, it will be apparent to those of skill in the art that many more embodiments and implementations are possible that are within the scope of this invention. Accordingly, the present invention is not to be restricted except in light of the attached claims and their equivalents. 

1. An imaging device, comprising: a semiconductor layer; a photodetector having an implanted region formed in the semiconductor layer and a pad formed over the implanted region, the pad having a malleable metallic material; and a readout circuit having a contact plug, the contact plug having a base and a prong extending from the base and into the malleable metallic material.
 2. An imaging device according to claim 1, wherein the malleable metallic material is Indium.
 3. An imaging device according to claim 1, wherein the prong comprises a conductive material adapted to substantially bond to the malleable metallic material of the pad.
 4. An imaging device according to claim 3, wherein the conductive material is Tungsten.
 5. An imaging device according to claim 1, wherein the prong is a first of a plurality of prongs extending from the base and into the malleable metallic material, the prongs being effective to form electrical contact with and displace a portion of the malleable metallic material into a space between the first prong and a second of the prongs.
 6. An imaging device according to claim 1, wherein the imaging device further comprises a first pair of stop elements each of which is disposed over the semiconductor layer such that the pad is disposed between the first pair of stop elements, and wherein the readout circuit has a first side and a second pair of stop elements disposed on the first side, the base of the contact plug being affixed to the first side such that the prong extends away from the first side and between the second pair of stop elements, the first pair of stop elements being disposed relative to and contacting the second pair of stop elements such that the prong of the contact plug is inhibited from passing completely through the pad.
 7. An imaging device according to claim 6, wherein the prong is a first of a plurality of prongs extending from the base, away from the first side of the readout circuit and into the malleable metallic material, a first prong and a second of the prongs defining a space therebetween and being effective to collectively displace a portion of the malleable metallic material into the space between the first prong and the second prong.
 8. An imaging device according to claim 1, wherein the imaging device further comprises a first pair of stop elements each of which is disposed over the semiconductor layer such that the pad is disposed between the first pair of stop elements, and wherein the readout circuit has a first side, the base of the contact plug being affixed to the first side of the readout circuit such that the prong extends away from the first side and between the first pair of stop elements, the first pair of stop elements being disposed relative to and contacting the first side of the readout circuit such that the prong of the contact plug is inhibited from passing completely through the pad.
 9. An imaging device according to claim 8, wherein the prong is a first of a plurality of prongs extending from the base of the contact plug, away from the first side of the readout circuit and into the malleable metallic material, a first prong and a second of the prongs defining a space therebetween and being effective to collectively displace a portion of the malleable metallic material into the space between the first prong and the second prong.
 10. An imaging device according to claim 1, wherein the pad has a width that is within the range of 0.3 μm to 8 μm.
 11. An imaging device according to claim 10, wherein the prong is a first of a plurality of prongs extending from the base, away from the first side of the readout circuit and into the malleable metallic material, each adjacent pair of the prongs defining a space therebetween and being effective to collectively displace a portion of the malleable metallic material into the space between the respective adjacent pair of prongs, each of the prongs and each space between each adjacent pair of prongs have a combined width equal to or less than the width of the pad.
 12. An imaging device according to claim 1, wherein each prong has a width that is within the range of 0.25 μm to 0.5 μm.
 13. A method for manufacturing an imaging device, the method comprising: forming a contact pad over a surface of a semiconductor substrate, the contact pad having a malleable metallic material; providing a readout circuit having a first side and a contact plug, the contact plug having a base affixed to the first side and a plurality of prongs extending from the base away from the first side; and moving the first side of the readout circuit towards the substrate surface so that the prongs of the contact plug are pressed into the pad and displace a portion of the pad into a space defined by and between a first and a second of the prongs.
 14. A method for manufacturing an imaging device as set forth in claim 13, wherein the contact pad is formed over a photodetector formed in the semiconductor substrate.
 15. A method for manufacturing an imaging device as set forth in claim 13, wherein the method further comprises: forming a first pair of stop elements over the substrate surface so that the contact pad is disposed between the first pair of stop elements; and providing a second pair of stop elements on the first side of the readout circuit so that the base of each contact plug is disposed between the second pair of stop elements and in substantial alignment with the first pair of stop elements formed over the substrate surface, wherein the first side of the readout circuit is moved towards the substrate surface in substantial axial alignment with the first and second pairs of stop elements until the first pair of stop elements contacts the second pair of stop elements, and a first of the first pair of stop elements and a first of the second pair of stop elements have a combined thickness that is more than a length of each prong such that the prongs are inhibited from passing completely through the contact pad when the first pair of stop elements contacts the second pair of stop elements.
 16. A method for manufacturing an imaging device as set forth in claim 15, wherein the method further comprises injecting epoxy into a cavity a portion of which is defined by at least two of the contact pad, the first of the first pair of stop elements, the first of the second pair of stop elements in contact with the first of the first pair of stop elements and the first side of the readout circuit.
 17. A method for manufacturing an imaging device as set forth in claim 16, wherein the injecting step further comprises warming the semiconductor substrate to a predetermined temperature that is less than the melting point of the malleable metallic material of the contact pad.
 18. A method for manufacturing an imaging device as set forth in claim 13, wherein the method further comprises: forming a first pair of stop elements over the substrate surface so that the contact pad is disposed between the first pair of stop elements, and wherein the first side of the readout circuit is moved towards the substrate surface until the first pair of stop elements contacts the first side of the readout circuit, and wherein each of the first pair of stop elements have a thickness that is more than a length of each prong such that the prongs are inhibited from passing completely through the contact pad when the first pair of stop elements contacts the first side of the readout circuit.
 19. A method for manufacturing an imaging device as set forth in claim 15, wherein the method further comprises injecting epoxy into a cavity a portion of which is defined by at least two of the contact pad, the first of the first pair of stop elements, the first of the second pair of stop elements in contact with the first of the first pair of stop elements and the first side of the readout circuit.
 20. A method for manufacturing an imaging device as set forth in claim 13, wherein the malleable metallic material is Indium.
 21. A method for manufacturing an imaging device as set forth in claim 13, wherein each prong comprises a conductive material adapted to substantially bond to the malleable metallic material of the contact pad.
 22. A method for manufacturing an imaging device as set forth in claim 21, wherein the conductive material is Tungsten.
 23. An imaging device, comprising: a first semiconductor layer having a first surface and a second surface; a first photodetector having a first implanted region formed in the first semiconductor layer and a pad formed over the first implanted region, the pad having a malleable metallic material; a readout circuit disposed over the first surface of the first semiconductor layer, the readout circuit having a plurality of contact plugs facing the first surface of the first semiconductor layer, a first of the contact plugs having a first base and a first prong extending from the first base and into the malleable metallic material of the pad of the first photodetector; a second semiconductor layer disposed below the second surface of the first semiconductor; a second photodetector having a second implanted region formed in the second semiconductor layer; and a metalized via extending through the first semiconductor layer and the second semiconductor layer so that the metalized via electrically connects the second implanted region to a second of the contact plugs of the readout circuit.
 24. An imaging device according to claim 23, wherein the first photodetector is effective to detect a first wavelength associated with a first portion of a predetermined band that passes through the second semiconductor layer and into the first semiconductor layer, and the second photodetector is effective to detect a second wavelength associated with a second portion of the predetermined band.
 25. An imaging device according to claim 24, wherein wavelengths associated with the first portion of a predetermined band are longer than wavelengths associated with the second portion of the predetermined band.
 26. An imaging device according to claim 23, wherein the malleable metallic material is Indium.
 27. An imaging device according to claim 26, wherein each contact plug comprises Tungsten.
 28. An imaging device according to claim 23, wherein the prong of the first contact plug is a first of a plurality of prongs extending from the base and into the malleable metallic material, the prongs being effective to form electrical contact with and displace a portion of the malleable metallic material into a space between the first prong and a second of the prongs.
 29. An imaging device according to claim 23, wherein the imaging device further comprises a first pair of stop elements each of which is disposed over the first surface of the first semiconductor layer such that the pad of the first photodetector is disposed between the first pair of stop elements, and wherein the readout circuit has a first side and a second pair of stop elements disposed on the first side, the base of the first contact plug being affixed to the first side such that the prong of the first contact plug extends away from the first side and between the second pair of stop elements, the first pair of stop elements being disposed relative to and contacting the second pair of stop elements such that the prong of the contact plug is inhibited from passing completely through the pad of the first photodetector layer.
 30. An imaging device according to claim 29, wherein the imaging device further comprises a third pair of stop elements each of which is disposed over the first surface of the first semiconductor layer such that the metalized via is disposed between the third pair of stop elements, and wherein the readout circuit has a fourth pair of stop elements disposed on the first side of the readout circuit, the third pair of stop elements being disposed relative to and contacting the fourth pair of stop elements such that a prong of the second contact plug is inhibited from contacting the first surface of the first semiconductor layer. 